TAPPI Sponsors Smart Packaging Event

Published: November 01, 2003, By David J. Bentley Jr., the PLACE Editor

Providing practical information to the converting and packaging industries —a Communication from the Polymers, Laminations, and Coatings Div. of TAPPI

TAPPI is sponsoring the Intelligent and Smart Packaging USA Conference with exhibition organized by Pira International and IDTechEx. The event is January 27 and 28, 2004, at the Las Vegas Hilton in Las Vegas, Nevada. The conference program will focus on the most important and significant technologies and applications likely to make dramatic changes in brand management and the supply chain during the next ten years.

Technologies covered during the meeting will include electronic article surveillance, radio frequency identification, smart inks, diagnostics, and polymer and other laminar electronics such as the transparent electronic package. Many unique features have been possible for years with intelligent and smart packaging technologies. Only now are retailers and brand owners poised to apply these exciting technologies in their supply chain and a store. Key players in the packaging area are working to make intelligent packaging a commercially viable, cost effective catalyst for change. Soon a packaged product in a store will talk to the customer, provide product freshness information, allow purchase without standing in line, and ensure cooking to perfection.

Additional information on the 2004 Intelligent and Smart Packaging USA Conference to include presentation titles, author names, and exhibitors at the meeting are available from Lucia Bly, the conference manager. Contact her by email at This email address is being protected from spambots. You need JavaScript enabled to view it.. When registering for this event, please reference “TAPPI.”