Messe Düsseldorf Announces Presence at PACK EXPO 2015

Published: August 27, 2015

CHICAGO, IL | Messe Düsseldorf (MDNA) will participate in PACK EXPO Las Vegas 2015, September 28–30, in order to promote its international trade fair for the packaging industry: interpack PROCESSES AND PACKAGING 2017, to be held from May 4–10, 2017, in Düsseldorf, Germany.

At PACK EXPO booth S-6832, interpack 2017 visitor information as well as exhibitor applications for individual booth space and for the US Pavilion (organized by MDNA) will be available. Brochures about hotel and travel arrangements for the show will also be offered. Also available will be information about the other packaging trade fairs in the Messe Düsseldorf worldwide program, including SWOP 2015 (November 17–20, 2015 in Shanghai, China), Upakovka 2016 (January 26–29, 2016, in Moscow, Russia), INDOPACK 2016 (September 7–10, 2016, in Jakarta, Indonesia), and International PackTech India 2016 (December 15–17, 2016, in Mumbai).

According to MDNA, interpack attracts more than 2,700 exhibitors from over 58 countries every three years. The show offers a comprehensive international range of products, including the latest in packaging systems and machinery, packaging materials, and confectionery machinery in 19 halls covering more than 2 million sq ft net of exhibit space.

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