Indium Material Enables Room Temperature Solder Bonding

Published: May 09, 2013

CHICAGO, IL | Indium Corp. featured NanoFoil at the recent Technical Conference held by the Society of Vacuum Coaters.

NanoFoil is an engineered material that enables room temperature solder bonding, NanoBonding. Company says the material is industry accepted and proven to lower manufacturing costs, while providing repeatable and reliable bonds. It is an instantaneous heat source, applicable to a variety of applications in many industries, that simplifies the sputtering target bonding process, while increasing margins and lowering capital expenditures.

Product is said to be environmentally non-toxic and non-hazardous. It has a low profile of 10–50 microns in thickness and is available in sheets, preforms, powders, and particles.

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