Kodak at Package Design 07

Published: January 25, 2007

PRESS RELEASE

ROCHESTER, NY—At the upcoming Package Design 07 Conference, Kodak will show packaging designers and brand owners how a combination of workflow, thermal CTP, and proofing solutions can help ensure consistent, accurate brand colors and packaging. The Package Design 07 Conference takes place January 30-February 1 at the Intl. Plaza Resort & Spa in Orlando, FL. In addition to exhibiting, Kodak will sponsor the three-day event. See kodak.com.