The Brand Zone to Connect PACK EXPO Attendees with Unique Ideas for Innovation

Published: July 25, 2012

For brand owners, printers and converters seeking container and material innovations that can drive brand loyalty and engagement and increase market share, The Brand Zone at PACK EXPO International 2012 (October 28-31; McCormick Place, Chicago) will be the place to be. Located in the Lower North Hall, this dedicated area will be home to the latest advancements in glass, plastic, metal and paperboard packaging, decorating, and labeling.

In addition to exhibits, attendees will have access to several new and returning features. These include:

• The Showcase of Packaging Innovations, sponsored by the Dow Chemical Co. will return to Chicago. This popular feature displays award-winning packaging from around the world, offering attendees a unique opportunity for inspiration.

• Material ConneXion will host an interactive display of advanced and sustainable materials. Located inside the Showcase of Packaging Innovations, attendees will be able to touch and feel a carefully selected sampling from the company’s global Materials Libraries that contain more than 6,500 different material innovations. Experts will be on hand to educate attendees about the different materials, many of which are come from outside of the packaging space and have cross-over potential. Material ConneXion will also present a series of daily materials demonstrations. Presentation topics and the schedule will be announced in the coming weeks.

• Mintel (Booth N-6214) will present compelling consumer and category insights in a special theater right inside the booth. Topics and a formal schedule will be available shortly. Attendees will also have access to Mintel’s research experts and reports addressing trends across in the food, beverage, retail, and cosmetic/personal care sectors and be able view a gallery of package designs from around the world, sourced from the company’s Global New Product Database.

• Following the success of the Consumer Retail Experience at PACK EXPO in 2011, Clemson University will make its Chicago debut with an exhibit that allows attendees to see how packaging drives purchase decisions.

To register for PACK EXPO International 2012, visit www.packexpo.com. Discounted rates apply until October 8, 2012.