BOBST Flexible-Packaging Technology Day set for Atlanta Competence Center April 29
Photo courtesy of BOBST
Swiss printing and converting machinery giant BOBST announces its 2025 Flexible Packaging Technology Day, a one-day event exclusively for converters, will take place April 29 at the company’s Atlanta Competence Center in Cumming, GA.
Created with converters in mind, this event will explore the latest advancements in flexible packaging production, with a focus on sustainability, process optimization, and real-world performance. Attendees will benefit from live equipment demonstrations, technical sessions, and direct interaction with BOBST experts and key industry partners.
Featured technologies Include:
- VISION CI-Flexo Press– high-efficiency, water-based printing
- NOVALAM S 550 Solventless Laminator– sustainability-focused lamination
- BOBST Connect– a digital platform enabling real-time productivity, energy, and waste management
In addition, experts from Wikoff, COIM, Synaptik, and Miraclon will offer insights into inks, substrates, adhesives, and process control.
What converters can expect:
- Hands-on equipment demonstrations
- Expert-led discussions on waste reduction, energy efficiency, and automation
- Networking with fellow converters, suppliers, and the BOBST team
Register here: BOBST Flexible Packaging Technology Day.
