Become a M.A. of Engineering in Packaging Technology
- Published: April 03, 2006, By pffc-online.com
PRESS RELEASE
NEUHAUSEN AM RHEINFALL—The world’s first Master of Engineering in Packaging Technology course to be conducted in English runs in parallel with candidates’ professional activities, and requires the candidate to have a first degree at bachelor level in a packaging-specific subject. It has been conceived in collaboration with the University of Applied Sciences (Germany), the University of Media (Germany), Zurich University of Applied Sciences (Switzerland), and Michigan State University (Lancing, MI).
The course aims to provide candidates with the skills required to assume senior positions within packaging and packing companies operating in the international arena. It is based on the four main strands; materials, machinery, fillgood technology (foodstuffs and pharmaceuticals) and business and management. The aim of the course is to greatly extend the participants’ knowledge and to expand their research and development expertise in the various areas of packaging technology, to develop their managerial expertise even further, and to put the knowledge and skills that have been obtained into practice in business as part of scientifically sound practical projects.
The study modules run in the form of 16 one-week blocks spread over a period of 24 months. In addition to the lectures in Neuhausen am Rheinfall, e-learning modules from Michigan State University are offered along with study trips to the U.S. and the ESIEC (Ecole Supérieurs d’Ingénieurs en Emballage et Conditionnement) in Reims, France. In the fourth semester, the masters thesis is completed over a period of months months. 60 credits are awarded for each year of study according to the international ETCS standards. Upon successful completion of the course, participants are awarded the academic degree of Master of Engineering in Packaging Technology by the University of Applied Sciences.
For more information, contact Roger Roth, +41 52 675 51 51, This email address is being protected from spambots. You need JavaScript enabled to view it., or visit ipi.sh.