New Packaging Technology Will Star at Pack Expo

Published: October 01, 2000, By Claudia Hine, Senior Editor

When Pack Expo International 2000 opens its doors on November 5, attendees will be able to witness the latest innovations in packaging and converting machinery and materials.

Located at McCormick Place in Chicago, IL, the show runs through November 9. More than 1 million net sq ft of exhibit space will be utilized by 1,600 exhibiting companies, and more than 75,000 attendees are expected, including 6,000 international visitors from 60 countries.

The biennial event, which is sponsored by Packaging Machinery Manufacturers Institute (PMMI), once again will be co-located with the International Exposition for Food Processors (IEFP). Sponsored by Food Processing Machinery & Supplies Association, IEFP will focus on the newest developments in processing technology to meet the challenges faced by the industry's food and beverage manufacturers. IEFP will feature more than 350 companies utilizing 200,000 net sq ft of exhibit space.

According to Tom Egan, PMMI show committee chairman, "Visitor response to the co-located events at Pack Expo '98 was extremely positive. Visitors were overwhelmingly satisfied with the combination of packaging and processing technologies."

Exhibit hours are 9:00 a.m.-5:00 p.m. Sunday through Wednesday, and 9:00 a.m.-2:00 p.m. on Thursday. Advance registration is available until October 27 for $15.00 and includes both shows; on-site registration is $30.00.

For the fifth consecutive year, Pack Expo has been selected by the US Dept. of Commerce to participate in its International Buyer Program. Under this program, the Dept. of Commerce will use its worldwide network to promote the show. Department activities will include providing personnel at the show's International Business Center to match international buyers with US exhibitors; informing US companies about government export assistance programs; and assisting international buyers to meet their purchasing and representation objectives.

Full Conference Program
Included in Pack Expo will be Solutions 2000, said to be the world's largest packaging conference. Produced by Packaging Strategies in cooperation with PMMI, Solutions 2000 will present four concurrent session tracks daily, allowing packagers to choose from a variety of presentation topics. A special international track will be held each day. Visit the Pack Expo site at packexpo.com for conference registration fees and the complete program.

Following is a list of presentations of special interest to converters:

• Using Packaging to Overcome Toxins in Food

  , Barbara Blakistone, National Food Processors Association.

• Markets and Opportunities for Retortable and Standup Pouches in Japan and Asia

  , Masahiro "Mark" Shimoyamada, Dai Nippon Printing Co.

• EU and the Essential Requirements

  , John Webb-Jenkins, Institute of Packaging.

• Maximizing Asset Management with RFID

  , Peter J. Alvarez, John J. Pogorelec, and Leo L. McIntee, Uniform Code Council.

• 'Nude' Coding for Pharmaceutical Packaging: There's More Than Meets the Eye

  , Ralph Dillon, Pharmacia.

• Smart Packaging Technologies

  , Steven Van Fleet, International Paper Co., and Francois Dutray, Motorola Smartcard Solutions Div.

• E-Business or E-Commerce...What Does It All Mean?

  , Erich Spencer, Packexpo.com Inc.

• Harnessing the Internet to Network Package/Product Coding with Other Packaging Line Operations

  , Paul Mills, Markem Corp.

• Packaging and Food Safety in Latin America

  , Dr. Luis Madi, Institute of Food Technology, Sao Paulo, Brazil.

• Packaging Materials in Europe: Hygenic and Legal Aspects

  , Dr. Beatrix Wepner, Austrian Packaging Institute

• Security Packaging and Its Cost and Production Implications for End-Users and Retailers

  , Mike Kelley, Specialized Packaging, and Tom McMurray, Pfizer.

• Packaging Management Skill Set Analysis

  , Ed Lerner, Welch Foods.

• Web Strategy Development and Electronic Procurement and Sales of Materials, Containers, and Components

  , Schmalbach-Lubeca, White Cap, Bosch Machinery.

• Reducing Transaction Costs Through Electronic Direct Marketing

  , Katherine Hudson, Brady Corp.

• Packaging for the International Food Trade of Products

  , M. SC Lenin Ovando, Scientific Certification, Mexico.

• Package Handling across Borders

  , M.C. Adrian Avila, Mexican Center for Technology & Competition.

• High-Barrier Plastic Packaging for Food

  , Jeff Kellar, Tetrapak.

• Markets & Technologies for Case-Ready Meat Packaging

  , Dan Carr, Pactiv Corp.

• Extended Shelf Life & Aseptic Packaging of Low-Acid Products

  , Art Guenter, Serac, and Kelley McGregor, Gillispie, Natrel.

• Disposable, Two-Way Package Moisture Management Systems

  , Bob Esse, Humidi-Pak Corp. and Esse Technologies, and Dr. Al Saari, Humidi-Pak Corp.

• Package Design Considerations for Internet Marketing

  , Richard Gerstman, Interbrand US, and Joe Kornick, Kornick Lindsay.

• Protective and Distribution Packaging for B2B/B2C E-Commerce

  , Bill Armstrong, Sealed Air Corp.

• From Pallets to Parcels: The Next Generation of Packaging

  , Erik Aunan, 3M Packaging Systems Div.

For more information contact PMMI, 4350 N. Fairfax Dr., Ste. 600, Arlington, VA 22203; 703/243-8555; packexpo.com.